3 search results - page 1 / 1 » Exploring compromises among timing, power and temperature in... |
DAC
2006
ACM
14 years 5 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
DAC
2007
ACM
14 years 5 months ago
2007
ACM
Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. Prior work has looked at the performance,...
DAC
2003
ACM
14 years 5 months ago
2003
ACM
Power dissipation is becoming the most challenging design constraint in nanometer technologies. Among various design implementation schemes, standard cell ASICs offer the best pow...