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» Exploring serial vertical interconnects for 3D ICs
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1993
Tsinghua U.
13 years 9 months ago
The NuMesh: A Modular, Scalable Communications Substrate
Many standardized hardware communication interfaces offer runtime flexibility and configurability at the cost of efficiency. An alternate approach is the use of a highly-effic...
Steve Ward, Karim Abdalla, Rajeev Dujari, Michael ...