For submicron integrated circuits, 3D numerical techniques are required to accurately compute the values of the interconnect capacitances. In this paper, we describe an hierarchic...
To efficiently analyze the large-scale interconnect dominant circuits with inductive couplings (mutual inductances), this paper introduces a new state matrix, called VNA, to stamp ...
Hao Yu, Chunta Chu, Yiyu Shi, David Smart, Lei He,...
Abstract - Today's digital design systems are running out of steam, when it comes to meeting the challenges presented by simultaneous switching, power consumption and reliabil...
The simulation of on-chip inductance using PEEC-based circuit analysis methods often requires the solution of a subproblem where an extracted inductance matrix must be multiplied ...
Haitian Hu, David Blaauw, Vladimir Zolotov, Kaushi...
Due to the increasing operating frequencies and the manner in which the corresponding integrated circuits and systems must be designed, the extraction, modeling and simulation of ...
Hui Zheng, Lawrence T. Pileggi, Michael W. Beattie...