16 search results - page 1 / 4 » Fault tolerant placement and defect reconfiguration for nano... |
ICCAD
2008
IEEE
14 years 1 months ago
2008
IEEE
—When manufacturing nano-devices, defects are a certainty and reliability becomes a critical issue. Until now, the most pervasive methods used to address reliability, involve inj...
ARCS
2008
Springer
13 years 6 months ago
2008
Springer
Application details uncertain at design time as well as tolerance against permanent resource defects demand flexibility and redundancy. In this context, we present a strategy for p...
FPL
2006
Springer
13 years 8 months ago
2006
Springer
As manufacturing technology enters the ultra-deep submicron era, wafer yields are destined to drop due to higher occurrence of physical defects on the die. This paper proposes a y...
TC
1998
13 years 4 months ago
1998
—The very high levels of integration and submicron device sizes used in current and emerging VLSI technologies for FPGAs lead to higher occurrences of defects and operational fau...
ISVLSI
2006
IEEE
13 years 10 months ago
2006
IEEE
With advances in process technology, the feature sizes are decreasing, which leads to higher defect densities. More sophisticated techniques, at increased costs are required to av...