3 search results - page 1 / 1 » Full-chip thermal analysis for the early design stage via ge... |
ASPDAC
2008
ACM
13 years 6 months ago
2008
ACM
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...
ISLPED
2006
ACM
13 years 10 months ago
2006
ACM
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
DAC
2009
ACM
13 years 11 months ago
2009
ACM
Manufacturing process variability impacts the performance of synchronous logic circuits by means of its effect on both clock network and functional block delays. Typically, varia...