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ICCAD
1997
IEEE
118views Hardware» more  ICCAD 1997»
13 years 8 months ago
Global interconnect sizing and spacing with consideration of coupling capacitance
This paper presents an efficient approach to perform global interconnect sizing and spacing (GISS) for multiple nets to minimize interconnect delays with consideration of couplin...
Jason Cong, Lei He, Cheng-Kok Koh, David Zhigang P...
ASPDAC
1998
ACM
79views Hardware» more  ASPDAC 1998»
13 years 8 months ago
Simultaneous Wire Sizing and Wire Spacing in Post-Layout Performance Optimization
- In this paper, we study the wire sizing and wire spacing problem for post-layout performance optimization under Elmore delay model. Both ground capacitance and coupled capacitanc...
Jiang-An He, Hideaki Kobayashi
ICCAD
1993
IEEE
121views Hardware» more  ICCAD 1993»
13 years 8 months ago
Hierarchical extraction of 3D interconnect capacitances in large regular VLSI structures
For submicron integrated circuits, 3D numerical techniques are required to accurately compute the values of the interconnect capacitances. In this paper, we describe an hierarchic...
Arjan J. van Genderen, N. P. van der Meijs
ASPDAC
2004
ACM
149views Hardware» more  ASPDAC 2004»
13 years 10 months ago
A coupling and crosstalk considered timing-driven global routing algorithm for high performance circuit design
With the exponential reduction in the scaling of feature size, inter-wire coupling capacitance becomes the dominant part of load capacitance. Two problems are introduced by coupli...
Jingyu Xu, Xianlong Hong, Tong Jing, Ling Zhang, J...
ISQED
2006
IEEE
89views Hardware» more  ISQED 2006»
13 years 10 months ago
Study of Floating Fill Impact on Interconnect Capacitance
It is well known that fill insertion adversely affects total and coupling capacitance of interconnects. While grounded fill can be extracted by full-chip extractors, floating ...
Andrew B. Kahng, Kambiz Samadi, Puneet Sharma