33 search results - page 7 / 7 » Global propagation of side constraints for solving over-cons... |
PAMI
2008
13 years 5 months ago
2008
The aim of this paper is to achieve seamless image stitching without producing visual artifact caused by severe intensity discrepancy and structure misalignment, given that the inp...
ICCV
2009
IEEE
14 years 10 months ago
2009
IEEE
In this paper we propose an algorithm to estimate missing
values in tensors of visual data. The values can be missing
due to problems in the acquisition process, or because
the ...
ICCAD
2005
IEEE
14 years 2 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....