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ACSAC
2010
IEEE
11 years 10 months ago
Hardware assistance for trustworthy systems through 3-D integration
Jonathan Valamehr, Mohit Tiwari, Timothy Sherwood,...
HOST
2008
IEEE
12 years 6 months ago
Trustworthy System Security through 3-D Integrated Hardware
Ted Huffmire, Jonathan Valamehr, Timothy Sherwood,...
CASES
2010
ACM
11 years 9 months ago
Hardware trust implications of 3-D integration
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
Ted Huffmire, Timothy E. Levin, Michael Bilzor, Cy...
CARS
2004
12 years 1 months ago
Robotically assisted ablative treatment guided by freehand 3D ultrasound
Robots can improve the accuracy of image-guided needle placement over traditional free-hand techniques. While many research groups have demonstrated this, widespread clinical adopt...
Emad Boctor, Robert J. Webster III, Michael A. Cho...
3DIC
2009
IEEE
142views Hardware» more  3DIC 2009»
12 years 5 months ago
Electrical-thermal co-analysis for power delivery networks in 3D system integration
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...
Jianyong Xie, Daehyun Chung, Madhavan Swaminathan,...
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