31 search results - page 1 / 7 » Hardware assistance for trustworthy systems through 3-D inte... |
ACSAC
2010
IEEE
13 years 2 months ago
2010
IEEE
HOST
2008
IEEE
13 years 11 months ago
2008
IEEE
CASES
2010
ACM
13 years 1 months ago
2010
ACM
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
CARS
2004
13 years 5 months ago
2004
Robots can improve the accuracy of image-guided needle placement over traditional free-hand techniques. While many research groups have demonstrated this, widespread clinical adopt...
3DIC
2009
IEEE
13 years 9 months ago
2009
IEEE
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...