31 search results - page 2 / 7 » Hardware assistance for trustworthy systems through 3-D inte... |
ICCAD
2010
IEEE
13 years 2 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—Convergence of communication, consumer applications and computing within mobile systems pushes memory requirements both in terms of size, bandwidth and power consumption...
ISPD
2011
ACM
12 years 7 months ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
The first memristor, originally theorized by Dr. Leon Chua in 1971, was identified by a team at HP Labs in 2008. This new fundamental circuit element is unique in that its resis...
DFT
2006
IEEE
13 years 10 months ago
2006
IEEE
This paper1 discusses a defect tolerant and energy economized computing array for the DSP plane of a 3-D Heterogeneous System on a Chip. We present the J-platform, which employs c...