34 search results - page 7 / 7 » High Density Through Silicon Via (TSV) |
ICRA
2008
IEEE
13 years 12 months ago
2008
IEEE
—We introduce an inexpensive, low complexity power surface system capable of simultaneously providing wireless power and bidirectional communication from a surface to multiple mo...
TSP
2010
13 years 4 days ago
2010
Abstract--This paper develops an optimal decentralized algorithm for sparse signal recovery and demonstrates its application in monitoring localized phenomena using energy-constrai...
CICC
2011
12 years 5 months ago
2011
Efforts to achieve the long-standing dream of realizing scalable learning algorithms for networks of spiking neurons in silicon have been hampered by (a) the limited scalability of...
IWQOS
2004
Springer
13 years 10 months ago
2004
Springer
— Clustering sensor nodes increases the scalability and energy efficiency of communications among them. In hostile environments, unexpected failures or attacks on cluster heads ...