12 search results - page 3 / 3 » Improving cache lifetime reliability at ultra-low voltages |
TPDS
2010
13 years 2 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
ISPASS
2008
IEEE
13 years 10 months ago
2008
IEEE
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...