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ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
13 years 9 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
CORR
2010
Springer
112views Education» more  CORR 2010»
13 years 5 months ago
Colour Guided Colour Image Steganography
Information security has become a cause of concern because of the electronic eavesdropping. Capacity, robustness and invisibility are important parameters in information hiding and...
R. Amirtharajan, Sandeep Kumar Behera, Motamarri A...