162 search results - page 3 / 33 » Interconnect Analysis: From 3-D Structures to Circuit Models |
DAC
2006
ACM
14 years 6 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
CVPR
2000
IEEE
14 years 7 months ago
2000
IEEE
Scene ow is the 3D motion eld of points in the world. Given N (N > 1) image sequences gather ed with a N-eye stereo camera or N calibrated cameras, we present a novel system wh...
ICCAD
2004
IEEE
14 years 2 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
BMCBI
2004
13 years 5 months ago
2004
Background: Hidden Markov Models (HMMs) have proven very useful in computational biology for such applications as sequence pattern matching, gene-finding, and structure prediction...
TOG
2008
13 years 5 months ago
2008
We present an interactive system for generating photorealistic, textured, piecewise-planar 3D models of architectural structures and urban scenes from unordered sets of photograph...