108 search results - page 22 / 22 » Introspective 3D chips |
ISCA
2008
IEEE
13 years 12 months ago
2008
IEEE
We expect that many-core microprocessors will push performance per chip from the 10 gigaflop to the 10 teraflop range in the coming decade. To support this increased performance...
DAC
2010
ACM
13 years 9 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
DAC
2006
ACM
13 years 7 months ago
2006
ACM
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...