9 search results - page 1 / 2 » Keeping hot chips cool: are IC thermal problems hot air |
DAC
2008
ACM
13 years 6 months ago
2008
ACM
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
ISQED
2010
IEEE
13 years 9 months ago
2010
IEEE
- In this paper, we propose a thermal-aware job allocation and scheduling algorithm for three-dimensional (3D) chip multiprocessor (CMP). The proposed algorithm assigns hot jobs to...
DATE
2010
IEEE
13 years 9 months ago
2010
IEEE
—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
ISPASS
2009
IEEE
13 years 11 months ago
2009
IEEE
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
TVLSI
2008
13 years 4 months ago
2008
Thermal management is critical for integrated circuit (IC) design. With each new IC technology generation, feature sizes decrease, while operating speeds and package densities incr...