Sciweavers

8 search results - page 2 / 2
» Leakage power dependent temperature estimation to predict th...
Sort
View
ICCAD
2004
IEEE
88views Hardware» more  ICCAD 2004»
14 years 2 months ago
Interconnect lifetime prediction under dynamic stress for reliability-aware design
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
Zhijian Lu, Wei Huang, John Lach, Mircea R. Stan, ...
DAC
2006
ACM
14 years 6 months ago
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
ISLPED
2007
ACM
169views Hardware» more  ISLPED 2007»
13 years 6 months ago
Throughput of multi-core processors under thermal constraints
We analyze the effect of thermal constraints on the performance and power of multi-core processors. We propose system-level power and thermal models, and derive expressions for (a...
Ravishankar Rao, Sarma B. K. Vrudhula, Chaitali Ch...