Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
Zhijian Lu, Wei Huang, John Lach, Mircea R. Stan, ...
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
We analyze the effect of thermal constraints on the performance and power of multi-core processors. We propose system-level power and thermal models, and derive expressions for (a...
Ravishankar Rao, Sarma B. K. Vrudhula, Chaitali Ch...