3 search results - page 1 / 1 » Low-Overhead Core Swapping for Thermal Management |
PACS
2004
Springer
13 years 9 months ago
2004
Springer
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managemen...
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managem...
ASPLOS
2008
ACM
13 years 6 months ago
2008
ACM
Future multicore processors will be more susceptible to a variety of hardware failures. In particular, intermittent faults, caused in part by manufacturing, thermal, and voltage v...