Increased integration in the form of multiple processor cores on a single die, relatively constant die sizes, shrinking power envelopes, and emerging applications create a new cha...
Srikanth T. Srinivasan, Ravi Rajwar, Haitham Akkar...
Future scalable, high throughput, and high performance applications are likely to execute on platforms constructed by clustering multiple autonomous distributed servers, with reso...
A number of factors, such as the increasing popularity of wireless networks, the opportunities offered by 3G services, and the rapid proliferation of mobile devices, have stimulat...