6 search results - page 1 / 2 » Many-core design from a thermal perspective |
ISCA
2005
IEEE
13 years 10 months ago
2005
IEEE
The importance of pushing the performance envelope of disk drives continues to grow, not just in the server market but also in numerous consumer electronics products. One of the m...
DAC
2008
ACM
14 years 5 months ago
2008
ACM
Air cooling limits have been a major design challenge in recent years for integrated circuits. Multi-core exacerbates thermal challenges because power scales with the number of co...
ASPDAC
2008
ACM
13 years 6 months ago
2008
ACM
In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and o...
ISLPED
2005
ACM
13 years 10 months ago
2005
ACM
This paper studies the impact on energy efficiency and thermal behavior of design style and clock-gating style in queue and array structures. These structures are major sources of...
VLSID
2007
IEEE
14 years 4 months ago
2007
IEEE
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...