11 search results - page 1 / 3 » Non-tree routing for reliability and yield improvement |
ICCAD
2002
IEEE
14 years 1 months ago
2002
IEEE
We propose to introduce redundant interconnects for manufacturing yield and reliability improvement. By introducing redundant interconnects, the potential for open faults is reduc...
ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
This paper accurately considers wire short defects and proposes an algorithm to guarantee IC chip yield rate improvement for redundant wire insertion. Without considering yield ra...
GLVLSI
2009
IEEE
13 years 11 months ago
2009
IEEE
Based on the insertion of internal and external redundant wires into L-type and U-type wires, an efficient two-phase reliability-driven insertion algorithm is proposed to insert r...
ICCCN
2007
IEEE
13 years 10 months ago
2007
IEEE
—Wireless sensor networks (WSN) built using current Berkeley Mica motes exhibit low reliability for packet delivery. There is anecdotal evidence of poor packet delivery rates fro...
TCAD
2008
13 years 4 months ago
2008
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...