107 search results - page 22 / 22 » On Balancing Delay and Cost for Routing Paths |
ICPP
2007
IEEE
13 years 11 months ago
2007
IEEE
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
IWQOS
2004
Springer
13 years 10 months ago
2004
Springer
— Clustering sensor nodes increases the scalability and energy efficiency of communications among them. In hostile environments, unexpected failures or attacks on cluster heads ...