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NANONET
2009
Springer
199views Chemistry» more  NANONET 2009»
13 years 10 months ago
Through Silicon Via-Based Grid for Thermal Control in 3D Chips
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
José L. Ayala, Arvind Sridhar, Vinod Pangra...
SIGECOM
2008
ACM
151views ECommerce» more  SIGECOM 2008»
13 years 5 months ago
Security and insurance management in networks with heterogeneous agents
Computer users express a strong desire to prevent attacks and to reduce the losses from computer and information security breaches. However, security compromises are common and wi...
Jens Grossklags, Nicolas Christin, John Chuang