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» Optimal non-uniform wire-sizing under the Elmore delay model
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DATE
2007
IEEE
96views Hardware» more  DATE 2007»
13 years 10 months ago
Self-heating-aware optimal wire sizing under Elmore delay model
Global interconnect temperature keeps rising in the current and future technologies due to self-heating and the adiabatic property of top metal layers. The thermal e ects impact a...
Min Ni, Seda Ogrenci Memik
DAC
1994
ACM
13 years 8 months ago
RC Interconnect Optimization Under the Elmore Delay Model
An e cient solution to the wire sizing problem WSP usingthe Elmoredelaymodelisproposed. Two formulations of the problem are put forth: in the rst, the minimum interconnect delay i...
Sachin S. Sapatnekar
ASPDAC
1998
ACM
79views Hardware» more  ASPDAC 1998»
13 years 8 months ago
Simultaneous Wire Sizing and Wire Spacing in Post-Layout Performance Optimization
- In this paper, we study the wire sizing and wire spacing problem for post-layout performance optimization under Elmore delay model. Both ground capacitance and coupled capacitanc...
Jiang-An He, Hideaki Kobayashi
VLSID
1999
IEEE
93views VLSI» more  VLSID 1999»
13 years 8 months ago
Spec-Based Repeater Insertion and Wire Sizing for On-chip Interconnect
Recently Lillis, et al. presented an elegant dynamic programming approach to RC interconnect delay optimization through driver sizing, repeater insertion, and, wire sizing which e...
Noel Menezes, Chung-Ping Chen
ICCAD
1994
IEEE
61views Hardware» more  ICCAD 1994»
13 years 8 months ago
Simultaneous driver and wire sizing for performance and power optimization
In this paper, we study the simultaneousdriver and wire sizing (SDWS) problem under two objective functions: (i) delay minimization only, or (ii) combined delay and power dissipat...
Jason Cong, Cheng-Kok Koh