Sciweavers

7 search results - page 2 / 2
» Path Integral Monte Carlo Simulations and Analytical Approxi...
Sort
View
DATE
2009
IEEE
113views Hardware» more  DATE 2009»
13 years 11 months ago
New simulation methodology of 3D surface roughness loss for interconnects modeling
— As clock frequencies exceed giga-Hertz, the extra power loss due to conductor surface roughness in interconnects and packagings is more evident and thus demands a proper accou...
Quan Chen, Ngai Wong
DATE
2009
IEEE
113views Hardware» more  DATE 2009»
13 years 11 months ago
System-level process variability analysis and mitigation for 3D MPSoCs
Abstract—While prior research has extensively evaluated the performance advantage of moving from a 2D to a 3D design style, the impact of process parameter variations on 3D desig...
Siddharth Garg, Diana Marculescu