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» Performance, Energy, and Thermal Considerations for SMT and ...
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ICCD
2005
IEEE
98views Hardware» more  ICCD 2005»
14 years 1 months ago
Reducing the Latency and Area Cost of Core Swapping through Shared Helper Engines
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managem...
Anahita Shayesteh, Eren Kursun, Timothy Sherwood, ...