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ISCA
2003
IEEE
168views Hardware» more  ISCA 2003»
13 years 11 months ago
Temperature-Aware Microarchitecture
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...
CASES
2003
ACM
13 years 9 months ago
A hierarchical approach for energy efficient application design using heterogeneous embedded systems
Several features such as reconfiguration, voltage and frequency scaling, low-power operating states, duty-cycling, etc. are exploited for latency and energy efficient application ...
Sumit Mohanty, Viktor K. Prasanna