23 search results - page 1 / 5 » Power distribution paths in 3-D ICS |
GLVLSI
2009
IEEE
13 years 2 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
DAC
2012
ACM
11 years 7 months ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...