9 search results - page 1 / 2 » Practical iterated fill synthesis for CMP uniformity |
DAC
2000
ACM
14 years 5 months ago
2000
ACM
We propose practical iterated methods for layout density control for CMP uniformity, based on linear programming, Monte-Carlo and greedy algorithms. We experimentally study the tr...
TCAD
2002
13 years 4 months ago
2002
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
TCAD
2008
13 years 4 months ago
2008
We survey recent research and practice in the area of chemical
DAC
2009
ACM
14 years 5 months ago
2009
ACM
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
DAC
2003
ACM
14 years 5 months ago
2003
ACM
Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local ...