3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
Increasing power density in computing systems from laptops to servers has spurred interest in dynamic thermal management. Based on the success of dynamic voltage and frequency sca...
Heather Hanson, Stephen W. Keckler, Soraya Ghiasi,...
Designing thermal management policies for today's power-dense server clusters is currently a challenge, since it is difficult to predict the exact temperature and performance...