Abstract—With the increasing scaling of manufacturing technology, process variation is a phenomenon that has become more prevalent. As a result, in the context of Chip Multiproce...
Shengyan Hong, Sri Hari Krishna Narayanan, Mahmut ...
Process variations, which lead to timing and power variations across identically-designed components, have been identified as one of the key future design challenges by the semico...
Yang Ding, Mahmut T. Kandemir, Mary Jane Irwin, Pa...
Within-die process variation causes individual cores in a Chip Multiprocessor (CMP) to differ substantially in both static power consumed and maximum frequency supported. In this ...
Both custom IC and FPGA designs in the nanometer regime suffer from process variations. But different from custom ICs, FPGAs' programmability offers a unique design freedom t...
Within-die variation in leakage power consumption is substantial and increasing for chip-level multiprocessors (CMPs) and multiprocessor systems-on-chip. Dealing with this problem...
Lide Zhang, Lan S. Bai, Robert P. Dick, Li Shang, ...