22 search results - page 1 / 5 » Properties of and improvements to time-domain dynamic therma... |
DATE
2010
IEEE
13 years 9 months ago
2010
IEEE
—Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation co...
DATE
2006
IEEE
13 years 10 months ago
2006
IEEE
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
CCE
2005
13 years 4 months ago
2005
The Petlyuk distillation configuration has received considerable attention because of its efficiency to reduce the energy required for the separation of ternary mixtures. The stru...
ISLPED
2009
ACM
13 years 9 months ago
2009
ACM
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors that run multi-threaded workloads. We introduce a new predictor that utilizes the ...
RTCSA
2009
IEEE
13 years 11 months ago
2009
IEEE
Distributed real-time embedded systems have stringent requirements for key performance properties, such as endto-end timeliness and reliability, in order to operate properly. In r...