As manufacturing technology enters the ultra-deep submicron era, wafer yields are destined to drop due to higher occurrence of physical defects on the die. This paper proposes a y...
Nicola Campregher, Peter Y. K. Cheung, George A. C...
Future process nodes have such small feature sizes that there will be an increase in the number of manufacturing defects per die. For large FPGAs, it will be critical to tolerate ...
Divide-and-conquer is a well-suited programming paradigm for parallel Grid applications. Our Satin system efficiently schedules the finegrained tasks of a divide-and-conquer appli...
Gosia Wrzesinska, Rob van Nieuwpoort, Jason Maasse...
Commercial SRAM-based FPGAs have the potential to provide aerospace applications with the necessary performance to meet next-generation mission requirements. However, the suscepti...
— To increase the amount of logic available in SRAM-based FPGAs manufacturers are using nanometric technologies to boost logic density and reduce prices. However, nanometric scal...