14 search results - page 3 / 3 » Reducing reconfiguration time of reconfigurable computing sy... |
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...
DSN
2003
IEEE
13 years 10 months ago
2003
IEEE
The DepAuDE architecture provides middleware to integrate fault tolerance support into distributed embedded automation applications. It allows error recovery to be expressed in te...
DAC
2006
ACM
14 years 6 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
HPCA
2006
IEEE
14 years 5 months ago
2006
IEEE
As silicon technologies move into the nanometer regime, transistor reliability is expected to wane as devices become subject to extreme process variation, particle-induced transie...