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DATE
2010
IEEE
13 years 10 months ago
2010
IEEE
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
DAC
2010
ACM
13 years 9 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...