The transition to 300mm wafer size introduced a lot of new technologies to wafer fabrication facilities that mandated the presence of intrabay automated material handling systems ...
Wafers in a 300-mm semiconductor fabrication facility are transported throughout the factory in carriers called front opening unified pods (FOUPs). Two standard capacities of FOUP...
The application of simulation as a performance estimation tool in automated material handling system design is well documented, as is the amount of time required to build, debug, ...
Gerald T. Mackulak, Frederick P. Lawrence, Theron ...