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DAC
2001
ACM
14 years 5 months ago
Testing for Interconnect Crosstalk Defects Using On-Chip Embedded Processor Cores
Crosstalk effects degrade the integrity of signals traveling on long interconnects and must be addressed during manufacturing testing. External testing for crosstalk is expensive ...
Li Chen, Xiaoliang Bai, Sujit Dey
DAC
1996
ACM
13 years 9 months ago
A Parallel Precorrected FFT Based Capacitance Extraction Program for Signal Integrity Analysis
In order to optimize interconnect to avoid signal integrity problems, very fast and accurate 3-D capacitance extraction is essential. Fast algorithms, such as the multipole or prec...
Narayan R. Aluru, V. B. Nadkarni, James White
SAMOS
2004
Springer
13 years 10 months ago
High-Level Energy Estimation for ARM-Based SOCs
In recent years, power consumption has become a critical concern for many VLSI systems. Whereas several case studies demonstrate that technology-, layout-, and gate-level technique...
Dan Crisu, Sorin Cotofana, Stamatis Vassiliadis, P...
VLSID
2006
IEEE
150views VLSI» more  VLSID 2006»
14 years 5 months ago
A Comprehensive SoC Design Methodology for Nanometer Design Challenges
SoC design methodologies are under constant revision due to adoption of fast shrinking process technologies at nanometer levels. Nanometer process geometries exhibit new complex d...
R. Raghavendra Kumar, Ricky Bedi, Ramadas Rajagopa...
ISCA
2010
IEEE
210views Hardware» more  ISCA 2010»
13 years 10 months ago
An intra-chip free-space optical interconnect
Continued device scaling enables microprocessors and other systems-on-chip (SoCs) to increase their performance, functionality, and hence, complexity. Simultaneously, relentless s...
Jing Xue, Alok Garg, Berkehan Ciftcioglu, Jianyun ...