3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
Ted Huffmire, Timothy E. Levin, Michael Bilzor, Cy...
Many high-performance communicating systems are designed using the event-driven paradigm. As multicore platforms are now pervasive, it becomes crucial for such systems to take adva...