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CASES
2010
ACM
13 years 2 months ago
Hardware trust implications of 3-D integration
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
Ted Huffmire, Timothy E. Levin, Michael Bilzor, Cy...
ICDCS
2010
IEEE
13 years 5 months ago
Efficient Workstealing for Multicore Event-Driven Systems
Many high-performance communicating systems are designed using the event-driven paradigm. As multicore platforms are now pervasive, it becomes crucial for such systems to take adva...
Fabien Gaud, Sylvain Geneves, Renaud Lachaize, Bap...