Global interconnect temperature keeps rising in the current and future technologies due to self-heating and the adiabatic property of top metal layers. The thermal e ects impact a...
An e cient solution to the wire sizing problem WSP usingthe Elmoredelaymodelisproposed. Two formulations of the problem are put forth: in the rst, the minimum interconnect delay i...
- In this paper, we study the wire sizing and wire spacing problem for post-layout performance optimization under Elmore delay model. Both ground capacitance and coupled capacitanc...
Recently Lillis, et al. presented an elegant dynamic programming approach to RC interconnect delay optimization through driver sizing, repeater insertion, and, wire sizing which e...
In this paper, we determine the optimal shape function for a bi-directional wire under the Elmore delay model. Given a bi-directional wire of length L, let fx be the width of the ...