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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 2 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
MM
2006
ACM
203views Multimedia» more  MM 2006»
13 years 11 months ago
Learning image manifolds by semantic subspace projection
In many image retrieval applications, the mapping between highlevel semantic concept and low-level features is obtained through a learning process. Traditional approaches often as...
Jie Yu, Qi Tian
ECCV
2010
Springer
13 years 10 months ago
3D Point Correspondence by Minimum Description Length in Feature Space
Abstract. Finding point correspondences plays an important role in automatically building statistical shape models from a training set of 3D surfaces. For the point correspondence ...
ICDE
2000
IEEE
158views Database» more  ICDE 2000»
14 years 6 months ago
The DC-Tree: A Fully Dynamic Index Structure for Data Warehouses
: Many companies have recognized the strategic importance of the knowledge hidden in their large databases and have built data warehouses. Typically, updates are collected and appl...
Hans-Peter Kriegel, Jörn Kohlhammer, Martin E...
VLDB
2007
ACM
145views Database» more  VLDB 2007»
14 years 5 months ago
Executing Stream Joins on the Cell Processor
Low-latency and high-throughput processing are key requirements of data stream management systems (DSMSs). Hence, multi-core processors that provide high aggregate processing capa...
Bugra Gedik, Philip S. Yu, Rajesh Bordawekar