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WSC
2007
13 years 7 months ago
Simulation experimental investigation on job release control in semiconductor wafer fabrication
This paper presents a new job release methodology, WIPLOAD Control, especially in semiconductor wafer fabrication environment. The performance of the proposed methodology is evalu...
Chao Qi, Appa Iyer Sivakumar, Stanley B. Gershwin
WSC
2008
13 years 7 months ago
Determining an appropriate number of FOUPs in semiconductor wafer fabrication facilities
In this paper, multiple orders per job type formation and release strategies are described for semiconductor wafer fabrication facilities (wafer fabs). Different orders are groupe...
Jens Zimmermann, Scott J. Mason, John W. Fowler, L...