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DATE
2010
IEEE
156views Hardware» more  DATE 2010»
13 years 11 months ago
3D-integration of silicon devices: A key technology for sophisticated products
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
Armin Klumpp, Peter Ramm, R. Wieland
SIGMETRICS
1997
ACM
111views Hardware» more  SIGMETRICS 1997»
13 years 10 months ago
Cache Behavior of Network Protocols
In this paper we present a performance study of memory reference behavior in network protocol processing, using an Internet-based protocol stack implemented in the x-kernel runnin...
Erich M. Nahum, David J. Yates, James F. Kurose, D...
DAC
2010
ACM
13 years 9 months ago
TSV stress aware timing analysis with applications to 3D-IC layout optimization
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee,...
FOIKS
2008
Springer
13 years 7 months ago
Visibly Pushdown Transducers for Approximate Validation of Streaming XML
Visibly Pushdown Languages (VPLs), recognized by Visibly Pushdown Automata (VPAs), are a nicely behaved family of contextfree languages. It has been shown that VPAs are equivalent ...
Alex Thomo, Srinivasan Venkatesh, Ying Ying Ye
BMCBI
2007
132views more  BMCBI 2007»
13 years 5 months ago
TPRpred: a tool for prediction of TPR-, PPR- and SEL1-like repeats from protein sequences
Background: Solenoid repeat proteins of the Tetratrico Peptide Repeat (TPR) family are involved as scaffolds in a broad range of protein-protein interactions. Several resources ar...
Manjunatha R. Karpenahalli, Andrei N. Lupas, Johan...