—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
In this paper we present a performance study of memory reference behavior in network protocol processing, using an Internet-based protocol stack implemented in the x-kernel runnin...
Erich M. Nahum, David J. Yates, James F. Kurose, D...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Visibly Pushdown Languages (VPLs), recognized by Visibly Pushdown Automata (VPAs), are a nicely behaved family of contextfree languages. It has been shown that VPAs are equivalent ...
Background: Solenoid repeat proteins of the Tetratrico Peptide Repeat (TPR) family are involved as scaffolds in a broad range of protein-protein interactions. Several resources ar...
Manjunatha R. Karpenahalli, Andrei N. Lupas, Johan...