4 search results - page 1 / 1 » Study of Floating Fill Impact on Interconnect Capacitance |
ISQED
2006
IEEE
13 years 10 months ago
2006
IEEE
It is well known that fill insertion adversely affects total and coupling capacitance of interconnects. While grounded fill can be extracted by full-chip extractors, floating ...
VLSID
2007
IEEE
14 years 4 months ago
2007
IEEE
Abstract-- This paper presents the results obtained from an experimental study of the impact of modern process technologies on the electrical parameters of interconnects. Variation...
DAC
2003
ACM
14 years 5 months ago
2003
ACM
Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local ...
ICCD
2006
IEEE
14 years 1 months ago
2006
IEEE
Abstract— Capacitive and inductive crosstalk noises are expected to be more serious in advanced technologies. However, capacitive and inductive crosstalk noises in the future hav...