114 search results - page 23 / 23 » Sub-threshold design: the challenges of minimizing circuit e... |
ICCAD
2005
IEEE
14 years 2 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
CODES
2007
IEEE
13 years 12 months ago
2007
IEEE
We present a co-synthesis approach that accelerates reactive software processing by moving the calculation of complex expressions into external combinational hardware. The startin...
ICCAD
2008
IEEE
14 years 2 months ago
2008
IEEE
Abstract— As VLSI technology enters the nanoscale regime, interconnect delay becomes the bottleneck of circuit performance. Compared to gate delays, wires are becoming increasing...
DATE
2008
IEEE
13 years 12 months ago
2008
IEEE
— As the feature size of transistors gets smaller, fabricating them becomes challenging. Manufacturing process follows various corrective design-for-manufacturing (DFM) steps to ...