5 search results - page 1 / 1 » TRAM: A tool for Temperature and Reliability Aware Memory De... |
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
— Memories are increasingly dominating Systems on Chip (SoC) designs and thus contribute a large percentage of the total system’s power dissipation, area and reliability. In th...
ISLPED
2005
ACM
13 years 10 months ago
2005
ACM
Temperature is becoming a first rate design criterion in ASICs due to its negative impact on leakage power, reliability, performance, and packaging cost. Incorporating awareness o...
GLVLSI
2005
IEEE
13 years 10 months ago
2005
IEEE
A hierarchical scheme with cells and modules is crucial for managing design complexity during a large integrated circuit design. We present a methodology for thermal aware cell-ba...
IJES
2007
13 years 4 months ago
2007
: The power density in high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating ‘hot spotsâ€...
ISLPED
2010
ACM
13 years 4 months ago
2010
ACM
Estimation of static and dynamic energy of caches is critical for high-performance low-power designs. Commercial CAD tools performing energy estimation statically are not aware of...