2 search results - page 1 / 1 » TSV stress-aware full-chip mechanical reliability analysis a... |
DAC
2011
ACM
12 years 4 months ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
DAC
2012
ACM
11 years 6 months ago
2012
ACM
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...