3 search results - page 1 / 1 » Temperature aware microprocessor floorplanning considering a... |
ICCAD
2007
IEEE
14 years 1 months ago
2007
IEEE
This paper studies microprocessor floorplanning considering thermal and throughput optimization. We first develop a stochastic heat diffusion model taking into account the appl...
TPDS
2008
13 years 4 months ago
2008
Multicore architectures have been ruling the recent microprocessor design trend. This is due to different reasons: better performance, thread-level parallelism bounds in modern app...
VLSID
2010
IEEE
13 years 2 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...