30 search results - page 3 / 6 » Temperature- and Cost-Aware Design of 3D Multiprocessor Arch... |
DAC
2006
ACM
14 years 6 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
DAC
2006
ACM
13 years 7 months ago
2006
ACM
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
CF
2009
ACM
13 years 11 months ago
2009
ACM
In this paper, we compare the architectural perspectives of the Wave Field Synthesis (WFS) 3D-audio algorithm mapped on three different platforms: a General Purpose Processor (GP...
DATE
2008
IEEE
13 years 11 months ago
2008
IEEE
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thus, temperature gradients in Multiprocessor Systems on Chip (MPSoCs) can serious...
DAC
2010
ACM
13 years 9 months ago
2010
ACM
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...