2 search results - page 1 / 1 » Temperature-Aware Microarchitecture |
ISCA
2003
IEEE
13 years 9 months ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
APCSAC
2007
IEEE
13 years 8 months ago
2007
IEEE
Many years of CMOS technology scaling have resulted in increased power densities and higher core temperatures. Power and temperature concerns are now considered to be a primary cha...