: In VLSI circuits with deep sub-micron, the parasitic capacitance from interconnect is a very important factor determining circuit performances such as power and time-delay. The B...
For submicron integrated circuits, 3D numerical techniques are required to accurately compute the values of the interconnect capacitances. In this paper, we describe an hierarchic...
A virtual 3-D extractor of the single dielectric is presented in this paper. In the indirect boundary integral equations, the plane charge distribution on the surface of conductors...
With the adoption of ultra regular fabric paradigms for controlling design printability at the 22nm node and beyond, there is an emerging need for a layout-driven, pattern-based p...
Tarek A. El-Moselhy, Ibrahim M. Elfadel, Luca Dani...