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ASPDAC
1999
ACM
149views Hardware» more  ASPDAC 1999»
13 years 8 months ago
The Hierarchical h-Adaptive 3-D Boundary Element Computation of VLSI Interconnect Capacitance
: In VLSI circuits with deep sub-micron, the parasitic capacitance from interconnect is a very important factor determining circuit performances such as power and time-delay. The B...
Jinsong Hou, Zeyi Wang, Xianlong Hong
ICCAD
1993
IEEE
121views Hardware» more  ICCAD 1993»
13 years 8 months ago
Hierarchical extraction of 3D interconnect capacitances in large regular VLSI structures
For submicron integrated circuits, 3D numerical techniques are required to accurately compute the values of the interconnect capacitances. In this paper, we describe an hierarchic...
Arjan J. van Genderen, N. P. van der Meijs
ASPDAC
2001
ACM
82views Hardware» more  ASPDAC 2001»
13 years 8 months ago
A virtual 3-D multipole accelerated extractor for VLSI parasitic interconnect capacitance
A virtual 3-D extractor of the single dielectric is presented in this paper. In the indirect boundary integral equations, the plane charge distribution on the surface of conductors...
Zhaozhi Yang, Zeyi Wang, Shuzhou Fang
ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
13 years 2 months ago
A hierarchical floating random walk algorithm for fabric-aware 3D capacitance extraction
With the adoption of ultra regular fabric paradigms for controlling design printability at the 22nm node and beyond, there is an emerging need for a layout-driven, pattern-based p...
Tarek A. El-Moselhy, Ibrahim M. Elfadel, Luca Dani...