14 search results - page 1 / 3 » Thermal Management for 3D Processors via Task Scheduling |
ICPP
2008
IEEE
13 years 10 months ago
2008
IEEE
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
TPDS
2010
13 years 2 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
CODES
2007
IEEE
13 years 10 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
TACO
2010
13 years 2 months ago
2010
ISPASS
2008
IEEE
13 years 10 months ago
2008
IEEE
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...